• Tape Application System MBFLEX100 Pick and Place

    Tape Application System MBFLEX100 Pick and Place

    Pick & Place: semi-automatic application of die-cut adhesive

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    MBFLEX 100 – PICK & PLACE TAPE APPLICATION SYSTEM

    1.  Automatic system with manual feed for application of die-cut adhesive to various surfaces consisting of:

    • Automatic distribution of single die-cut adhesive directly to the point where it is picked by the cartesian robot.
    • Two-axis cartesian robot that picks and applies the die-cut adhesive with a suction cup.
    • Bay in which to place material that will receive die-cut adhesive.

    2. Unit managed by integrated electronic system with a touch-screen control panel for managing parameters.

    3. Maximum output: 1000 pieces/hour.

     

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